Low MOQ for Etching Engraving Machine - Stereolithography 3D SLA 3D Printer for UV Laser Additive manufacturing Processing

Low MOQ for Etching Engraving Machine - Stereolithography 3D SLA 3D Printer for UV Laser Additive manufacturing Processing – HAAS

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Low MOQ for Etching Engraving Machine - Stereolithography 3D SLA 3D Printer for UV Laser Additive manufacturing Processing – HAAS Detail:

Product Description

SLA(Stereolithography) is an additive manufacturing process that works by focusing an UV laser on to a vat of photopolymer resin. With the help of computer aided manufacturing or computer aided design(CAM/CAD) software, the UV laser is used to draw a pre-programmed design or shape on to the surface of the photopolymer vat. Photopolymers are sensitive to ultraviolet light, so the resin is photochemically solidified and forms a single layer of the desired 3D object. This process is repeated for each layer of the design until the 3D object is complete.
CARMANHAAS could offer customer the optical system mainly includes fast Galvanometer Scanner and F-THETA scan lens, Beam expander, Mirror, etc.

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Technical Parameters:

355nm Galvo Scanner Head

Model	PSH14-H	PSH20-H	PSH30-H
Water cool/sealed scan head	yes	yes	yes
Aperture (mm)	14	20	30
Effective Scan Angle	±10°	±10°	±10°
Tracking Error	0.19 ms	0.28ms	0.45ms
Step Response Time(1% of full scale)	≤ 0.4 ms	≤ 0.6 ms	≤ 0.9 ms
Typical Speed
Positioning / jump	< 15 m/s	< 12 m/s	< 9 m/s
Line scanning/raster scanning	< 10 m/s	< 7 m/s	< 4 m/s
Typical vector scanning	< 4 m/s	< 3 m/s	< 2 m/s
Good Writing quality	700 cps	450 cps	260 cps
High writing quality	550 cps	320 cps	180 cps
Precision
Linearity	99.9%	99.9%	99.9%
Resolution	≤ 1 urad	≤ 1 urad	≤ 1 urad
Repeatability	≤ 2 urad	≤ 2 urad	≤ 2 urad
Temperature Drift
Offset Drift	≤ 3 urad/℃	≤ 3 urad/℃	≤ 3 urad/℃
Qver 8hours Long-Term Offset Drift （After 15min warn-up）	≤ 30 urad	≤ 30 urad	≤ 30 urad
Operating Temperature Range	25℃±10℃	25℃±10℃	25℃±10℃
Signal Interface	Analog: ±10V Digital: XY2-100 protocol	Analog: ±10V Digital: XY2-100 protocol	Analog: ±10V Digital: XY2-100 protocol
Input Power Requirement (DC)	±15V@ 4A Max RMS	±15V@ 4A Max RMS	±15V@ 4A Max RMS

355nm F-Theta Lenses

Part Description	Focal Length (mm)	Scan Field (mm)	Max Entrance Pupil (mm)	Working Distance(mm)	Mounting Thread
SL-355-360-580	580	360×360	16	660	M85x1
SL-355-520-750	750	520×520	10	824.4	M85x1
SL-355-610-840-(15CA)	840	610×610	15	910	M85x1
SL-355-800-1090-(18CA)	1090	800×800	18	1193	M85x1

355nm Beam Expander

Part Description	Expansion Ratio	Input CA (mm)	Output CA (mm)	Housing Dia(mm)	Housing Length(mm)	Mounting Thread
BE3-355-D30:84.5-3x-A(M301-M430.5)	3X	10	33	46	84.5	M301-M430.5
BE3-355-D33:84.5-5x-A(M301-M430.5)	5X	10	33	46	84.5	M301-M430.5
BE3-355-D33:80.3-7x-A(M301-M430.5)	7X	10	33	46	80.3	M301-M430.5
BE3-355-D30:90-8x-A(M301-M430.5)	8X	10	33	46	90.0	M301-M430.5
BE3-355-D30:72-10x-A(M301-M430.5)	10X	10	33	46	72.0	M301-M430.5

355nm Mirror

Part Description	Diameter(mm)	Thickness(mm)	Coating
355 Mirror	30	3	HR@355nm,45° AOI
355 Mirror	20	5	HR@355nm,45° AOI
355 Mirror	30	5	HR@355nm,45° AOI

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